79RC32T355-133DH vs IDT79RC64T575-200DP feature comparison

79RC32T355-133DH Integrated Device Technology Inc

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IDT79RC64T575-200DP Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description 28 X 28 MM, 3.40 MM HEIGHT, MO-143FA1, PLASTIC, QFP-208 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208
Pin Count 208 208
Reach Compliance Code not_compliant compliant
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 26 64
Bit Size 32 64
Boundary Scan YES YES
Clock Frequency-Max 67 MHz 125 MHz
External Data Bus Width 32 64
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PQFP-G208 S-PQFP-G208
JESD-609 Code e0 e0
Length 28 mm 28 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 208 208
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Equivalence Code QFP208,1.2SQ,20 QFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 225 NOT SPECIFIED
Power Supplies 2.5,3.3 V 2.5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 4.1 mm
Speed 133 MHz 200 MHz
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade COMMERCIAL OTHER
Terminal Finish Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Width 28 mm 28 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 10 10
Supply Current-Max 880 mA
Technology CMOS

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