79RC32T355-133DH
vs
ACT-7000ASC-350F24T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
AEROFLEX MICROELECTRONIC SOLUTIONS
Part Package Code
QFP
Package Description
28 X 28 MM, 3.40 MM HEIGHT, MO-143FA1, PLASTIC, QFP-208
QFP, QFP208,1.2SQ,20
Pin Count
208
Reach Compliance Code
not_compliant
unknown
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
26
Bit Size
32
64
Boundary Scan
YES
Clock Frequency-Max
67 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PQFP-G208
S-CQFP-G208
JESD-609 Code
e0
Length
28 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Terminals
208
208
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
FQFP
QFP
Package Equivalence Code
QFP208,1.2SQ,20
QFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
FLATPACK
Peak Reflow Temperature (Cel)
225
Power Supplies
2.5,3.3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
Speed
133 MHz
350 MHz
Supply Voltage-Max
2.625 V
Supply Voltage-Min
2.375 V
Supply Voltage-Nom
2.5 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Width
28 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
3
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
Technology
CMOS
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