79RC32T336-150BCG vs XPC823CZT25 feature comparison

79RC32T336-150BCG Integrated Device Technology Inc

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XPC823CZT25 Motorola Semiconductor Products

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MOTOROLA INC
Part Package Code BGA
Package Description LBGA, BGA256,16X16,40 BGA,
Pin Count 256
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 22 26
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 75 MHz 25 MHz
External Data Bus Width 32 32
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1
Length 17 mm 23 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 256 256
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -45 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 2.35 mm
Speed 150 MHz
Supply Current-Max 750 mA
Supply Voltage-Max 2.625 V 3.6 V
Supply Voltage-Min 2.375 V 3 V
Supply Voltage-Nom 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2

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