79R4700133DP vs 79RC32T351100DH feature comparison

79R4700133DP Integrated Device Technology Inc

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79RC32T351100DH Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description FQFP, QFP208,1.2SQ,20 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208
Pin Count 208 208
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 64 26
Bit Size 64 32
Boundary Scan YES YES
Clock Frequency-Max 67 MHz 50 MHz
External Data Bus Width 64 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PQFP-G208 S-PQFP-G208
JESD-609 Code e0 e0
Length 28 mm 28 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 208 208
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Equivalence Code QFP208,1.2SQ,20 QFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 4.1 mm
Speed 133 MHz 100 MHz
Supply Current-Max 1675 mA
Supply Voltage-Max 5.25 V 2.625 V
Supply Voltage-Min 4.75 V 2.375 V
Supply Voltage-Nom 5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 28 mm 28 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 4 3

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