79R3081E33MJ vs 79R3041-25JG8 feature comparison

79R3081E33MJ Integrated Device Technology Inc

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79R3041-25JG8 Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFN LCC
Package Description QCCJ, LDCC84,1.2SQ QCCJ, LDCC84,1.2SQ
Pin Count 84 84
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 50 MHz 50 MHz
External Data Bus Width 32 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e3
Length 29.083 mm 29.275 mm
Low Power Mode YES NO
Moisture Sensitivity Level 1 1
Number of Terminals 84 84
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.57 mm
Speed 33 MHz 25 MHz
Supply Current-Max 1050 mA 300 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15) MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 29.083 mm 29.275 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Additional Feature BURST BUS; 5 PIPELINE STAGES

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Compare 79R3041-25JG8 with alternatives