79R3041-33PF9
vs
XC68EZ328PU16V
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
MOTOROLA INC
|
| Part Package Code |
QFP
|
|
| Package Description |
LFQFP,
|
TFQFP,
|
| Pin Count |
100
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
BURST BUS; 5 PIPELINE STAGES
|
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
66.67 MHz
|
0.0384 MHz
|
| External Data Bus Width |
32
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
|
| Length |
14 mm
|
14 mm
|
| Low Power Mode |
NO
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
TFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.2 mm
|
| Speed |
33 MHz
|
16.58 MHz
|
| Supply Voltage-Max |
5.25 V
|
|
| Supply Voltage-Min |
4.75 V
|
|
| Supply Voltage-Nom |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare 79R3041-33PF9 with alternatives
Compare XC68EZ328PU16V with alternatives