79R3041-33JG8 vs 79R308120MJB feature comparison

79R3041-33JG8 Integrated Device Technology Inc

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79R308120MJB Integrated Device Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC QFN
Package Description QCCJ, LDCC84,1.2SQ QCCJ, LDCC84,1.2SQ
Pin Count 84 84
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature BURST BUS; 5 PIPELINE STAGES
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 66.66 MHz 50 MHz
External Data Bus Width 32 32
Format FIXED POINT FLOATING POINT
Integrated Cache NO YES
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e3 e0
Length 29.275 mm 29.083 mm
Low Power Mode NO YES
Moisture Sensitivity Level 1 1
Number of Terminals 84 84
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.572 mm
Speed 33 MHz 20 MHz
Supply Current-Max 370 mA 550 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish MATTE TIN Tin/Lead (Sn85Pb15)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 29.275 mm 29.083 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code No
Peak Reflow Temperature (Cel) 225
Screening Level MIL-STD-883 Class B
Time@Peak Reflow Temperature-Max (s) 30

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