74V2T04STR
vs
74HC3G06DP
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NEXPERIA
|
| Part Package Code |
SOT-23
|
|
| Package Description |
LSSOP, TSSOP8,.1
|
TSSOP,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
74V
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G8
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e4
|
| Length |
2.9 mm
|
3 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
INVERTER
|
INVERTER
|
| Max I(ol) |
0.008 A
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
3
|
3
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP8,.1
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Prop. Delay@Nom-Sup |
9.5 ns
|
|
| Propagation Delay (tpd) |
9.5 ns
|
125 ns
|
| Qualification Status |
Not Qualified
|
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
1.45 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Finish |
TIN
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.625 mm
|
3 mm
|
| Base Number Matches |
1
|
2
|
| Date Of Intro |
|
2017-02-01
|
| Output Characteristics |
|
OPEN-DRAIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare 74V2T04STR with alternatives
Compare 74HC3G06DP with alternatives