74LVT16244BDGG,112 vs 74LVTH574MTC feature comparison

74LVT16244BDGG,112 NXP Semiconductors

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74LVTH574MTC Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Part Package Code TSSOP TSSOP
Package Description 6.10 MM, PLASTIC, MO-153, SOT362-1, TSSOP-48 TSSOP,
Pin Count 48 20
Manufacturer Package Code SOT362-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Control Type ENABLE LOW
Family LVT LVT
JESD-30 Code R-PDSO-G48 R-PDSO-G20
Length 12.5 mm 6.5 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.064 A
Moisture Sensitivity Level 1 1
Number of Bits 4 8
Number of Functions 4 1
Number of Ports 2 2
Number of Terminals 48 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP48,.3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 3.2 ns
Propagation Delay (tpd) 4 ns 5.3 ns
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 6.1 mm 4.4 mm
Base Number Matches 2 3
Pbfree Code Yes
Additional Feature BROADSIDE VERSION OF 374
JESD-609 Code e4
Terminal Finish NICKEL PALLADIUM GOLD

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