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74LVCH32245AEC,557 vs 74LVCH32245AEC feature comparison

74LVCH32245AEC,557 NXP Semiconductors

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74LVCH32245AEC Philips Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code BGA
Package Description 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96 FBGA, BGA96,6X16,32
Pin Count 96
Manufacturer Package Code SOT536-1
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Control Type COMMON CONTROL COMMON CONTROL
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family LVC/LCX/Z
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0 e0
Length 13.5 mm
Logic IC Type BUS TRANSCEIVER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 4
Number of Bits 8 8
Number of Functions 4 4
Number of Ports 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA FBGA
Package Equivalence Code BGA96,6X16,32 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 4.5 ns 4.5 ns
Propagation Delay (tpd) 4.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.2 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 5.5 mm
Base Number Matches 1 2
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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