74LVCH32245AEC,557 vs IDT74LVCH32245ABF8 feature comparison

74LVCH32245AEC,557 NXP Semiconductors

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IDT74LVCH32245ABF8 Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96 LFBGA-96
Pin Count 96 96
Manufacturer Package Code SOT536-1
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0 e0
Length 13.5 mm 13.5 mm
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Max I(ol) 0.024 A
Moisture Sensitivity Level 4 3
Number of Bits 8 8
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 4.5 ns
Propagation Delay (tpd) 4.7 ns 4.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 5.5 mm 5.5 mm
Base Number Matches 1 2
Pbfree Code No
ECCN Code EAR99
Date Of Intro 1998-10-01
Additional Feature WITH DIRECTION CONTROL

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