74LVCH16244AEV
vs
935281129551
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Package Description
VFBGA,
VFBGA,
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
2017-02-01
Additional Feature
IT ALSO OPERATES AT 1.65 TO 3.6 V
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PBGA-B56
R-PBGA-B56
JESD-609 Code
e0
e0
Length
7 mm
7 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
2
Number of Bits
4
4
Number of Functions
4
4
Number of Ports
2
2
Number of Terminals
56
56
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA56,6X10,25
BGA56,6X10,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
240
Propagation Delay (tpd)
11.3 ns
6 ns
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
4.5 mm
4.5 mm
Base Number Matches
3
2
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