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74LVCH16244AEV vs 74LVC16244AEV,118 feature comparison

74LVCH16244AEV Nexperia

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74LVC16244AEV,118 NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description VFBGA, VFBGA, BGA56,6X10,25
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-02-01
Additional Feature IT ALSO OPERATES AT 1.65 TO 3.6 V
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e0 e0
Length 7 mm 7 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 2 2
Number of Bits 4 4
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 56 56
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA56,6X10,25 BGA56,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 240 240
Propagation Delay (tpd) 11.3 ns 6 ns
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Width 4.5 mm 4.5 mm
Base Number Matches 3 2
Part Package Code BGA
Pin Count 56
Manufacturer Package Code SOT702-1
Control Type ENABLE LOW
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Packing Method TR
Prop. Delay@Nom-Sup 5.5 ns
Qualification Status Not Qualified
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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Compare 74LVC16244AEV,118 with alternatives