74LVC3G14GM
vs
74LVC3GU04DP
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
QFN
|
|
| Package Description |
1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8
|
TSSOP, TSSOP8,.16
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
|
| JESD-30 Code |
S-PQCC-N8
|
R-PDSO-G8
|
| Length |
1.6 mm
|
|
| Logic IC Type |
INVERTER
|
INVERTER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
3
|
|
| Number of Inputs |
1
|
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
TSSOP
|
| Package Equivalence Code |
LCC8,.06SQ,20
|
TSSOP8,.16
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
TR
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
12 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
YES
|
NO
|
| Seated Height-Max |
0.5 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.6 mm
|
|
| Base Number Matches |
3
|
3
|
| Max I(ol) |
|
0.024 A
|
|
|
|
Compare 74LVC3G14GM with alternatives