74LVC2G17GW,125 vs 74LVC2G07GV-Q100H feature comparison

74LVC2G17GW,125 NXP Semiconductors

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74LVC2G07GV-Q100H Nexperia

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Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code TSSOP TSOP
Package Description PLASTIC, SC-88, SOT-363, 6 PIN TSSOP,
Pin Count 6 6
Manufacturer Package Code SOT363 SOT457
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Length 2 mm 2.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR, 7 INCH
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 7.1 ns
Propagation Delay (tpd) 13.1 ns 8.4 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.5 mm
Base Number Matches 1 1
Factory Lead Time 6 Weeks
Samacsys Manufacturer Nexperia
Output Characteristics OPEN-DRAIN
Screening Level AEC-Q100

Compare 74LVC2G17GW,125 with alternatives

Compare 74LVC2G07GV-Q100H with alternatives