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74LVC2G17GW,125 vs SN74LVC2G07YZPR feature comparison

74LVC2G17GW,125 NXP Semiconductors

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SN74LVC2G07YZPR Rochester Electronics LLC

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code TSSOP BGA
Package Description PLASTIC, SC-88, SOT-363, 6 PIN GREEN, DSBGA-6
Pin Count 6 6
Manufacturer Package Code SOT363
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-XBGA-B6
JESD-609 Code e3 e1
Length 2 mm 1.4 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSSOP VFBGA
Package Equivalence Code TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 7.1 ns
Propagation Delay (tpd) 13.1 ns 8.6 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) TIN SILVER COPPER
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 1.25 mm 0.9 mm
Base Number Matches 2 2
Pbfree Code No
Output Characteristics OPEN-DRAIN
Logic » Gates
Logic » Gates

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