74LVC2G157DCURE4
vs
74LV257N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
PHILIPS SEMICONDUCTORS
Part Package Code
SOIC
Package Description
VSSOP, TSSOP8,.12,20
DIP, DIP16,.3
Pin Count
8
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G8
R-PDIP-T16
JESD-609 Code
e4
e0
Length
2.3 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
Number of Functions
1
4
Number of Inputs
2
2
Number of Outputs
1
Number of Terminals
8
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
DIP
Package Equivalence Code
TSSOP8,.12,20
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
IN-LINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
14 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.9 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
2 mm
Base Number Matches
1
2
Load Capacitance (CL)
50 pF
Max I(ol)
0.008 A
Prop. Delay@Nom-Sup
30 ns
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