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74LVC2G157DCURE4 vs 74LV153N,112 feature comparison

74LVC2G157DCURE4 Texas Instruments

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74LV153N,112 NXP Semiconductors

Buy Now Datasheet
Pbfree Code No
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code SOIC DIP
Package Description VSSOP, TSSOP8,.12,20 DIP, DIP16,.3
Pin Count 8 16
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G8 R-PDIP-T16
JESD-609 Code e4 e4
Length 2.3 mm 19.025 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1
Number of Functions 1 2
Number of Inputs 2 4
Number of Outputs 1 1
Number of Terminals 8 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP DIP
Package Equivalence Code TSSOP8,.12,20 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 14 ns 41 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.9 mm 4.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 2 mm 7.62 mm
Base Number Matches 1 1
Manufacturer Package Code SOT38-4
Load Capacitance (CL) 50 pF
Max I(ol) 0.006 A
Prop. Delay@Nom-Sup 39 ns
Logic » Multiplexer/Demultiplexers
Logic » Multiplexer/Demultiplexers

Compare 74LVC2G157DCURE4 with alternatives

Compare 74LV153N,112 with alternatives