74LVC2G07GXZ
vs
74LVC2G34GXZ
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NEXPERIA
|
NEXPERIA
|
| Package Description |
X2SON-6
|
X2SON-6
|
| Manufacturer Package Code |
SOT1255-2
|
SOT1255-2
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
Nexperia
|
Nexperia
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PBCC-B6
|
R-PBCC-N6
|
| JESD-609 Code |
e4
|
e4
|
| Length |
1 mm
|
1 mm
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-DRAIN
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVBCC
|
HVBCC
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR, 7 INCH
|
TR, 7 INCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
8.4 ns
|
10.8 ns
|
| Seated Height-Max |
0.35 mm
|
0.35 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
BUTT
|
NO LEAD
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
0.8 mm
|
0.8 mm
|
| Base Number Matches |
1
|
1
|
| Power Supply Current-Max (ICC) |
|
0.004 mA
|
| Prop. Delay@Nom-Sup |
|
10.8 ns
|
|
|
|
Compare 74LVC2G07GXZ with alternatives
Compare 74LVC2G34GXZ with alternatives