74LVC2G34GXZ
vs
TC7PZ07FU
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NEXPERIA
|
TOSHIBA CORP
|
Package Description |
X2SON-6
|
TSSOP,
|
Manufacturer Package Code |
SOT1255-2
|
|
Reach Compliance Code |
compliant
|
unknown
|
Samacsys Manufacturer |
Nexperia
|
Toshiba
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PBCC-N6
|
R-PDSO-G6
|
JESD-609 Code |
e4
|
|
Length |
1 mm
|
2 mm
|
Logic IC Type |
BUFFER
|
BUFFER
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
2
|
2
|
Number of Inputs |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVBCC
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR, 7 INCH
|
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Power Supply Current-Max (ICC) |
0.004 mA
|
100 mA
|
Prop. Delay@Nom-Sup |
10.8 ns
|
10.5 ns
|
Propagation Delay (tpd) |
10.8 ns
|
10.5 ns
|
Seated Height-Max |
0.35 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
0.8 mm
|
1.25 mm
|
Base Number Matches |
1
|
1
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.032 A
|
Output Characteristics |
|
OPEN-DRAIN
|
Package Equivalence Code |
|
TSSOP6,.08
|
Schmitt Trigger |
|
NO
|
Screening Level |
|
AEC-Q100
|
Terminal Pitch |
|
0.65 mm
|
|
|
|
Compare 74LVC2G34GXZ with alternatives
Compare TC7PZ07FU with alternatives