74LVC2G07GW,132 vs 74LVC2G17GW feature comparison

74LVC2G07GW,132 Nexperia

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74LVC2G17GW Philips Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA PHILIPS SEMICONDUCTORS
Package Description TSSOP,
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Length 2 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1 1
Number of Functions 2
Number of Inputs 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 8.4 ns
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm
Base Number Matches 1 3
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code TSSOP6,.08
Packing Method TR
Prop. Delay@Nom-Sup 7.1 ns
Qualification Status Not Qualified
Schmitt Trigger YES

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