Findchips: Compare 74LVC2G07GW-Q100,125 vs SN74LVC2G07DCK

74LVC2G07GW-Q100,125 vs SN74LVC2G07DCK feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	TEXAS INSTRUMENTS INC
Package Description	TSSOP,	TSSOP, TSSOP6,.08
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G6	R-PDSO-G6
Length	2 mm	2 mm
Logic IC Type	BUFFER	BUFFER
Number of Functions	2	2
Number of Inputs	1	1
Number of Terminals	6	6
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	OPEN-DRAIN	OPEN-DRAIN
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)	8.4 ns	8.6 ns
Screening Level	AEC-Q100
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	INDUSTRIAL
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	1.25 mm	1.25 mm
Base Number Matches	2	1
Rohs Code		Yes
Samacsys Manufacturer		Texas Instruments
Max I(ol)		0.032 A
Package Equivalence Code		TSSOP6,.08
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Power Supply Current-Max (ICC)		0.01 mA
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Logic » Gates	Logic » Gates