Findchips: Compare 74LVC2G07FX4-7 vs 74LVC2G17GV,125

74LVC2G07FX4-7 vs 74LVC2G17GV,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	DIODES INC	NXP SEMICONDUCTORS
Part Package Code	DFN	TSOP
Package Description	VFBGA,	PLASTIC, SC-74, SOT-457, 6 PIN
Pin Count	6	6
Reach Compliance Code	compliant	compliant
ECCN Code	EAR99
HTS Code	8542.39.00.01	8542.39.00.01
Factory Lead Time	8 Weeks
Samacsys Manufacturer	Diodes Incorporated	NXP
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PBGA-B6	R-PDSO-G6
JESD-609 Code	e4	e3
Length	1.4 mm	2.9 mm
Logic IC Type	BUFFER	BUFFER
Moisture Sensitivity Level	1	1
Number of Functions	2	2
Number of Inputs	1	1
Number of Terminals	6	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	OPEN-DRAIN
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	VFBGA	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	260	260
Propagation Delay (tpd)	8.4 ns	13.1 ns
Seated Height-Max	0.4 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	NICKEL PALLADIUM GOLD	Tin (Sn)
Terminal Form	BALL	GULL WING
Terminal Pitch	0.5 mm	0.95 mm
Terminal Position	BOTTOM	DUAL
Time@Peak Reflow Temperature-Max (s)	30	30
Width	0.9 mm	1.5 mm
Base Number Matches	1	2
Manufacturer Package Code		SOT457
Package Equivalence Code		TSOP6,.11,37
Packing Method		TR
Qualification Status		Not Qualified
Schmitt Trigger		YES
	Logic » Gates	Logic » Gates