74LVC2G06GV,125
vs
NL27WZ04DTT1
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ONSEMI
|
Part Package Code |
TSOP
|
TSOP
|
Package Description |
PLASTIC, SOT-457, SC-74, TSOP-6
|
TSOP-6
|
Pin Count |
6
|
6
|
Manufacturer Package Code |
SOT457
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
Family |
LVC/LCX/Z
|
27WZ
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
JESD-609 Code |
e3
|
e0
|
Length |
2.9 mm
|
3 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
INVERTER
|
INVERTER
|
Max I(ol) |
0.024 A
|
0.024 A
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Inputs |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Characteristics |
OPEN-DRAIN
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSOP6,.11,37
|
TSOP6,.11,37
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
235
|
Propagation Delay (tpd) |
8.2 ns
|
11 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
NO
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
Terminal Finish |
Tin (Sn)
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.95 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.5 mm
|
1.5 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare 74LVC2G06GV,125 with alternatives
Compare NL27WZ04DTT1 with alternatives