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74LVC1G86GM,132 vs 74AUP1G11GW,125 feature comparison

74LVC1G86GM,132 NXP Semiconductors

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74AUP1G11GW,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON TSSOP
Package Description 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 PLASTIC, SC-88, SOT-363, 6 PIN
Pin Count 6 6
Manufacturer Package Code SOT886 SOT363
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z AUP/ULP/V
JESD-30 Code R-PDSO-N6 R-PDSO-G6
JESD-609 Code e3 e3
Length 1.45 mm 2 mm
Logic IC Type XOR GATE AND GATE
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 3
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Equivalence Code SOLCC6,.04,20 TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 13 ns 18.3 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 0.8 V
Supply Voltage-Nom (Vsup) 3.3 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1.25 mm
Base Number Matches 2 2
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Prop. Delay@Nom-Sup 18.3 ns
Logic » Gates
Logic » Gates

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