74LVC1G86GM,132
vs
NC7SZ27L6X
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
SON
MicroPak
Package Description
1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
1 MM, MICROPAK-6
Pin Count
6
6
Manufacturer Package Code
SOT886
6LD, MICROPAK, JEDEC MO-252,1.0MM WIDE (Logic style X overs)
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-N6
R-XQCC-N6
JESD-609 Code
e3
e4
Length
1.45 mm
1.45 mm
Logic IC Type
XOR GATE
NOR GATE
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
2
3
Number of Terminals
6
6
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
VSON
VQCCN
Package Equivalence Code
SOLCC6,.04,20
SOLCC6,.04,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
CHIP CARRIER, VERY THIN PROFILE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
13 ns
19 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
0.5 mm
0.55 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Tin (Sn)
NICKEL GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1 mm
1 mm
Base Number Matches
2
3
Pbfree Code
ECCN Code
EAR99
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Prop. Delay@Nom-Sup
8.5 ns
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