74LVC1G66GF
vs
74LVC1G66GM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SON
SON
Package Description
1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6
1 MM X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6
Pin Count
6
6
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
S-PBCC-N6
R-PBCC-N6
JESD-609 Code
e3
e3
Length
1 mm
1.45 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
6
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VQCCN
VQCCN
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, VERY THIN PROFILE
CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
3 ns
3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.5 mm
0.5 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Tin (Sn)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.35 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1 mm
1 mm
Base Number Matches
2
2
Compare 74LVC1G66GF with alternatives
Compare 74LVC1G66GM with alternatives