74LVC1G66GM
vs
74LVC1G66GM,115
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SON
|
SON
|
Package Description |
1 MM X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6
|
1 X 1.45 MM, 0.50 MM HEIGHT , MO-252, SOT886, XSON-6
|
Pin Count |
6
|
6
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PBCC-N6
|
R-PDSO-N6
|
JESD-609 Code |
e3
|
e3
|
Length |
1.45 mm
|
1.45 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VQCCN
|
VSON
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
3 ns
|
3 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.5 mm
|
0.5 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1 mm
|
1 mm
|
Base Number Matches |
2
|
2
|
Manufacturer Package Code |
|
SOT886
|
Factory Lead Time |
|
4 Weeks
|
Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare 74LVC1G66GM with alternatives
Compare 74LVC1G66GM,115 with alternatives