74LVC1G66GF vs 74LVC1G66GM,132 feature comparison

74LVC1G66GF NXP Semiconductors

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74LVC1G66GM,132 Nexperia

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code SON SON
Package Description 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6 1 X 1.45 MM, 0.50 MM HEIGHT , MO-252, SOT886, XSON-6
Pin Count 6 6
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code S-PBCC-N6 R-PDSO-N6
JESD-609 Code e3 e3
Length 1 mm 1.45 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VQCCN VSON
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 3 ns 3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) TIN
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.35 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1 mm
Base Number Matches 2 1
Manufacturer Package Code SOT886
Factory Lead Time 6 Weeks
Samacsys Manufacturer Nexperia
Packing Method TR, 7 INCH

Compare 74LVC1G66GF with alternatives

Compare 74LVC1G66GM,132 with alternatives