74LVC1G34GF,132 vs 74LVC1G34GM,115 feature comparison

74LVC1G34GF,132 NXP Semiconductors

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74LVC1G34GM,115 Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code SON SON
Package Description 1 X 1 X 0.50 MM PITCH, PLASTIC, SOT-891, XSON-6 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
Pin Count 6 6
Manufacturer Package Code SOT891 SOT886
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code S-PDSO-N6 R-PDSO-N6
JESD-609 Code e3 e3
Length 1 mm 1.45 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VSON
Package Equivalence Code SOLCC6,.04,14
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR TR, 7 INCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 20.8 ns 11 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 0.8 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) TIN
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.35 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1 mm
Base Number Matches 1 1
Samacsys Manufacturer Nexperia

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