74LVC1G34GF,132
vs
74LVC1G34GF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
SON
Package Description
1 X 1 X 0.50 MM PITCH, PLASTIC, SOT-891, XSON-6
VSON,
Pin Count
6
Manufacturer Package Code
SOT891
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
S-PDSO-N6
S-PDSO-N6
JESD-609 Code
e3
e3
Length
1 mm
1 mm
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
1
1
Number of Terminals
6
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
VSON
Package Equivalence Code
SOLCC6,.04,14
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
20.8 ns
11 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
0.5 mm
0.5 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
0.8 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.35 mm
0.35 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1 mm
1 mm
Base Number Matches
2
2
Compare 74LVC1G34GF,132 with alternatives
Compare 74LVC1G34GF with alternatives