74LVC1G32GM
vs
74LVC1G32GM-Q100
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NEXPERIA
|
Part Package Code |
SON
|
|
Package Description |
1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
|
|
Pin Count |
6
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-N6
|
R-PDSO-N6
|
JESD-609 Code |
e3
|
e4
|
Length |
1.45 mm
|
1.45 mm
|
Logic IC Type |
OR GATE
|
OR GATE
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Inputs |
2
|
2
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSON
|
VSON
|
Package Equivalence Code |
SOLCC6,.04,20
|
SOLCC6,.04,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
10.5 ns
|
10.5 ns
|
Qualification Status |
Not Qualified
|
|
Schmitt Trigger |
NO
|
YES
|
Seated Height-Max |
0.5 mm
|
0.5 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
Tin (Sn)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1 mm
|
1 mm
|
Base Number Matches |
3
|
1
|
Date Of Intro |
|
2019-01-25
|
Power Supply Current-Max (ICC) |
|
0.004 mA
|
Screening Level |
|
AEC-Q100
|
|
|
|
Compare 74LVC1G32GM with alternatives
Compare 74LVC1G32GM-Q100 with alternatives