74LVC1G157GM,115 vs V62/04660-02YE feature comparison

74LVC1G157GM,115 NXP Semiconductors

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V62/04660-02YE Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SON TSSOP
Package Description 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 TSSOP, TSSOP16,.25
Pin Count 6 16
Manufacturer Package Code SOT886
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-N6 R-PDSO-G16
JESD-609 Code e3 e4
Length 1.45 mm 5 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 1 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 6 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Equivalence Code SOLCC6,.04,20 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 13 ns 5.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Tin (Sn) NICKEL PALLADIUM GOLD
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 4.4 mm
Base Number Matches 1 1
Pbfree Code Yes
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Number of Bits 2
Output Characteristics 3-STATE
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 6.4 ns

Compare 74LVC1G157GM,115 with alternatives

Compare V62/04660-02YE with alternatives