74LVC1G157GM,115
vs
74LVC1G157GW
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SON
SOT-363
Package Description
1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6
PLASTIC, SOT-363, SC-88, 6 PIN
Pin Count
6
6
Manufacturer Package Code
SOT886
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-N6
R-PDSO-G6
JESD-609 Code
e3
e3
Length
1.45 mm
2 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
6
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
TSSOP
Package Equivalence Code
SOLCC6,.04,20
TSSOP6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
13 ns
13 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.5 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1 mm
1.25 mm
Base Number Matches
2
3
Pbfree Code
Samacsys Manufacturer
NXP
Compare 74LVC1G157GM,115 with alternatives
Compare 74LVC1G157GW with alternatives