74LVC1G157GM,115 vs PI74LVC157AL feature comparison

74LVC1G157GM,115 NXP Semiconductors

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PI74LVC157AL Pericom Semiconductor Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS PERICOM SEMICONDUCTOR CORP
Part Package Code SON TSSOP
Package Description 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 TSSOP, TSSOP16,.25
Pin Count 6 16
Manufacturer Package Code SOT886
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-N6 R-PDSO-G16
JESD-609 Code e3 e0
Length 1.45 mm 5 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 1 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 6 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Equivalence Code SOLCC6,.04,20 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TUBE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 13 ns 13.9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) TIN LEAD
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1 mm 4.4 mm
Base Number Matches 1 2
Pbfree Code No
ECCN Code EAR99
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Prop. Delay@Nom-Sup 5.2 ns

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