74LVC16374ADL,112
vs
VC16541ADL-T
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Part Package Code |
SSOP
|
|
Package Description |
7.50 MM, PLASTIC, MO-118, SOT370-1, SSOP-48
|
SSOP,
|
Pin Count |
48
|
|
Manufacturer Package Code |
SOT370-1
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Date Of Intro |
2017-02-01
|
|
Samacsys Manufacturer |
Nexperia
|
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
JESD-609 Code |
e4
|
|
Length |
15.875 mm
|
15.875 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
8
|
8
|
Number of Functions |
2
|
2
|
Number of Ports |
2
|
2
|
Number of Terminals |
48
|
48
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
SSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
7.5 ns
|
6.2 ns
|
Seated Height-Max |
2.8 mm
|
2.8 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.2 V
|
1.2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.5 mm
|
7.5 mm
|
Base Number Matches |
1
|
2
|
Additional Feature |
|
WITH DUAL OUTPUT ENABLE
|
Load Capacitance (CL) |
|
50 pF
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare 74LVC16374ADL,112 with alternatives
Compare VC16541ADL-T with alternatives