74LVC162245ADGG
vs
74LVC16245AEV,157
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
TSSOP
|
BGA
|
Package Description |
6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48
|
VFBGA, BGA56,6X10,25
|
Pin Count |
48
|
56
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
NXP
|
|
Additional Feature |
WITH DIRECTION CONTROL
|
WITH DIRECTION CONTROL
|
Control Type |
COMMON CONTROL
|
COMMON CONTROL
|
Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G48
|
R-PBGA-B56
|
JESD-609 Code |
e4
|
e0
|
Length |
12.5 mm
|
7 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
Max I(ol) |
0.012 A
|
0.024 A
|
Moisture Sensitivity Level |
1
|
2
|
Number of Bits |
8
|
8
|
Number of Functions |
2
|
2
|
Number of Ports |
2
|
2
|
Number of Terminals |
48
|
56
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE WITH SERIES RESISTOR
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
VFBGA
|
Package Equivalence Code |
TSSOP48,.3,20
|
BGA56,6X10,25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Prop. Delay@Nom-Sup |
6.3 ns
|
6 ns
|
Propagation Delay (tpd) |
9.5 ns
|
6 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.2 V
|
1.2 V
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
Width |
6.1 mm
|
4.5 mm
|
Base Number Matches |
3
|
2
|
Manufacturer Package Code |
|
SOT702-1
|
Packing Method |
|
TRAY
|
|
|
|
Compare 74LVC162245ADGG with alternatives
Compare 74LVC16245AEV,157 with alternatives
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74LVC16245AEV,157 vs 74LVT16374ADL,112
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74LVC16245AEV,157 vs 74LVCH16245ADL,112
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74LVC16245AEV,157 vs 74LVT162245BDL,112
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74LVC16245AEV,157 vs 74LVC16245AEV
-
74LVC16245AEV,157 vs 74LVT16245BDL,118
-
74LVC16245AEV,157 vs 74LVT16245BDL
-
74LVC16245AEV,157 vs 74LVCH16245ADGG
-
74LVC16245AEV,157 vs 74LVC16245ADL,118
-
74LVC16245AEV,157 vs 74LVCH16245AEV,157