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74LVC16245AEV,157 vs 74LVC16245AEV feature comparison

74LVC16245AEV,157 NXP Semiconductors

Buy Now Datasheet

74LVC16245AEV Philips Semiconductors

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code BGA
Package Description VFBGA, BGA56,6X10,25 FBGA, BGA56,6X10,25
Pin Count 56
Manufacturer Package Code SOT702-1
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DIRECTION CONTROL
Control Type COMMON CONTROL COMMON CONTROL
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family LVC/LCX/Z
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e0 e0
Length 7 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS TRANSCEIVER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 2
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2
Number of Terminals 56 56
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA FBGA
Package Equivalence Code BGA56,6X10,25 BGA56,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Packing Method TRAY
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 6 ns 4.5 ns
Propagation Delay (tpd) 6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 4.5 mm
Base Number Matches 2 3
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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