74LVC00ABQ
vs
74HCT14BQ
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
QFN
QFN
Package Description
HVQCCN, LCC14,.1X.12,20
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
HCT
JESD-30 Code
R-PQCC-N14
R-PQCC-N14
JESD-609 Code
e4
e4
Length
3 mm
3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
INVERTER
Max I(ol)
0.024 A
0.004 A
Moisture Sensitivity Level
1
1
Number of Functions
4
6
Number of Inputs
2
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC14,.1X.12,20
LCC14,.1X.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
5.5 ns
51 ns
Propagation Delay (tpd)
6.5 ns
51 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
YES
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
1.2 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
2.5 mm
2.5 mm
Base Number Matches
3
3
Compare 74LVC00ABQ with alternatives
Compare 74HCT14BQ with alternatives