74LVC00ABQ
vs
74HC08BQ
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
QFN
Package Description
HVQCCN, LCC14,.1X.12,20
HVQCCN,
Pin Count
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
HC/UH
JESD-30 Code
R-PQCC-N14
R-PQCC-N14
JESD-609 Code
e4
e4
Length
3 mm
3 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
AND GATE
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC14,.1X.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
5.5 ns
Propagation Delay (tpd)
6.5 ns
135 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
6 V
Supply Voltage-Min (Vsup)
1.2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD SILVER
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
2.5 mm
2.5 mm
Base Number Matches
3
3
Date Of Intro
1991-01-01
Compare 74LVC00ABQ with alternatives
Compare 74HC08BQ with alternatives