74LCX32BQX
vs
74VCX00BQX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
MLP
MLP
Package Description
2.50 X 3 MM, MO-241AA, DQFN-14
2.50 X 3 MM, LEAD FREE, MO-241AA, DQFN-14
Pin Count
14
14
Manufacturer Package Code
14LD,DQFN,JEDEC MO-241,2.5 X 3.0MM
14LD,DQFN,JEDEC MO-241,2.5 X 3.0MM
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
ALVC/VCX/A
JESD-30 Code
R-XQCC-N14
R-XQCC-N14
JESD-609 Code
e4
e4
Length
3 mm
3 mm
Load Capacitance (CL)
50 pF
30 pF
Logic IC Type
OR GATE
NAND GATE
Max I(ol)
0.024 A
0.024 A
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC14,.1X.12,20
LCC14,.1X.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
5.5 ns
2.8 ns
Propagation Delay (tpd)
6.6 ns
37 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
0.8 mm
0.8 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
2.5 mm
2.5 mm
Base Number Matches
1
1
Compare 74LCX32BQX with alternatives
Compare 74VCX00BQX with alternatives