74HCT74NB
vs
CD54HCT74F3A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
HARRIS SEMICONDUCTOR
Package Description
DIP,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
Length
19.025 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
53 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
fmax-Min
18 MHz
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e0
Max Frequency@Nom-Sup
16000000 Hz
Max I(ol)
0.004 A
Package Equivalence Code
DIP14,.3
Screening Level
38535Q/M;38534H;883B
Terminal Finish
TIN LEAD
Compare 74HCT74NB with alternatives
Compare CD54HCT74F3A with alternatives