74HCT564NB vs TC74HCT564AF(TP1) feature comparison

74HCT564NB NXP Semiconductors

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TC74HCT564AF(TP1) Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Package Description DIP, SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature BROADSIDE VERSION OF 534 BROADSIDE VERSION OF 534; ENABLE TIME @ RL=1K
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-PDSO-G20
Length 26.73 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 53 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.3 mm
Base Number Matches 1 1
Part Package Code SOIC
Pin Count 20

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