74HCT540NB vs TC74HCT540AP feature comparison

74HCT540NB NXP Semiconductors

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TC74HCT540AP Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Package Description DIP, DIP, DIP20,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DUAL OUTPUT ENABLE
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-PDIP-T20
Length 26.73 mm 24.6 mm
Load Capacitance (CL) 50 pF 150 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 36 ns 33 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
Rohs Code Yes
Part Package Code DIP
Pin Count 20
Samacsys Manufacturer Toshiba
Control Type ENABLE LOW
Max I(ol) 0.006 A
Package Equivalence Code DIP20,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 25 ns
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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