TC74HCT540AP vs TC74HCT563AP feature comparison

TC74HCT540AP Toshiba America Electronic Components

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TC74HCT563AP Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP20,.3 DIP, DIP20,.3
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Control Type ENABLE LOW
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-PDIP-T20
Length 24.6 mm 24.6 mm
Load Capacitance (CL) 150 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A 0.006 A
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 25 ns 36 ns
Propagation Delay (tpd) 33 ns 36 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Additional Feature BROADSIDE VERSION OF 533
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

Compare TC74HCT540AP with alternatives

Compare TC74HCT563AP with alternatives