74HCT365DB,118 vs CD74HCT365M feature comparison

74HCT365DB,118 NXP Semiconductors

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CD74HCT365M Harris Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Part Package Code SSOP1
Package Description PLASTIC, SSOP-16
Pin Count 16
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE
Control Type ENABLE LOW ENABLE LOW
Family HCT HCT
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A 0.006 A
Moisture Sensitivity Level 1
Number of Bits 6 6
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP16,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 29 ns 32 ns
Propagation Delay (tpd) 38 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm
Base Number Matches 2 7

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