74HCT2G08DC
vs
74HC2G08DP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
TSSOP, TSSOP8,.12,20
TSSOP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G8
S-PDSO-G8
Load Capacitance (CL)
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.004 A
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP8,.12,20
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Prop. Delay@Nom-Sup
36 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
3
Pbfree Code
Part Package Code
SOIC
Pin Count
8
ECCN Code
EAR99
Samacsys Manufacturer
NXP
Family
HC/UH
JESD-609 Code
e4
Length
3 mm
Moisture Sensitivity Level
1
Number of Functions
2
Number of Inputs
2
Propagation Delay (tpd)
110 ns
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3 mm
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