74HCT238BQ,115
vs
MC74F537DW
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
QFN
Package Description
2.5 X 3.5 MM, 0.85 MM HEIGHT, MO-241, DHVQFN-16
SOP, SOP20,.4
Pin Count
16
Manufacturer Package Code
SOT763-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HCT
Input Conditioning
STANDARD
JESD-30 Code
R-PQCC-N16
R-PDSO-G20
JESD-609 Code
e4
e0
Length
3.5 mm
Logic IC Type
3-LINE TO 8-LINE DECODER
DECIMAL DECODER/DRIVER
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
16
20
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-40 °C
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
53 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
TTL
Temperature Grade
AUTOMOTIVE
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
2.5 mm
Base Number Matches
2
3
Max I(ol)
0.024 A
Package Equivalence Code
SOP20,.4
Power Supplies
5 V
Power Supply Current-Max (ICC)
66 mA
Prop. Delay@Nom-Sup
16 ns
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