74HCT238BQ,115 vs 74HCT238BQ feature comparison

74HCT238BQ,115 NXP Semiconductors

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74HCT238BQ Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code QFN
Package Description 2.5 X 3.5 MM, 0.85 MM HEIGHT, MO-241, DHVQFN-16 HVQCCN,
Pin Count 16
Manufacturer Package Code SOT763-1
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PQCC-N16 R-PQCC-N16
JESD-609 Code e4 e4
Length 3.5 mm 3.5 mm
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 53 ns 53 ns
Qualification Status Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD SILVER
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 2.5 mm 2.5 mm
Base Number Matches 2 2
ECCN Code EAR99
Date Of Intro 1993-01-01

Compare 74HCT238BQ,115 with alternatives

Compare 74HCT238BQ with alternatives