74HCT1G66GW,125
vs
74HCT1G66GW,165
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
TSSOP
TSSOP
Package Description
1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5
1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5
Pin Count
5
5
Manufacturer Package Code
SOT353-1
SOT353-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e3
e3
Length
2 mm
2 mm
Moisture Sensitivity Level
1
1
Normal Position
NO
NO
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
5
5
Off-state Isolation-Nom
50 dB
50 dB
On-state Resistance-Max (Ron)
142 Ω
142 Ω
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP5/6,.08
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Switch-off Time-Max
53 ns
53 ns
Switch-on Time-Max
36 ns
36 ns
Switching
MAKE-BEFORE-BREAK
MAKE-BEFORE-BREAK
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.25 mm
1.25 mm
Base Number Matches
2
2
Compare 74HCT1G66GW,125 with alternatives
Compare 74HCT1G66GW,165 with alternatives